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首页> 外文期刊>Physica status solidi, B. Basic research >Nanohardness of a Ti thin film and its interface deposited by an electron beam on a 304 SS substrate
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Nanohardness of a Ti thin film and its interface deposited by an electron beam on a 304 SS substrate

机译：Ti薄膜的纳米硬度及其通过电子束在304 SS衬底上沉积的界面

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摘要

The results of nanohardness measurements at a film surface and film-substrate interface are presented and discussed. An electron beam device was used to deposit a Ti film on a 304 stainless steel (304 SS) substrate. The diluted interface was obtained by thermal activated atomic diffusion. The. Ti film and Ti film-304 SS interface were analyzed by energy dispersive spectrometry and were observed using atomic force microscopy. The nanohardness of the Ti film-304 SS system was measured by a nanoindentation technique. The results showed the Ti film-304 SS interface had a higher hardness value than the Ti film and 304 SS substrate. The Ti film surface had a lower hardness due to the presence of a TiO2 thin layer. [References: 14]
机译：提出并讨论了在膜表面和膜-基底界面处的纳米硬度测量结果。使用电子束装置在304不锈钢（304 SS）基板上沉积Ti膜。通过热活化原子扩散获得稀释的界面。的。通过能量色散法分析Ti膜和Ti膜-304 SS界面，并使用原子力显微镜观察。通过纳米压痕技术测量Ti膜-304 SS系统的纳米硬度。结果表明，Ti膜-304 SS界面的硬度值高于Ti膜和304 SS衬底。由于存在TiO 2薄层，因此Ti膜表面的硬度较低。 [参考：14]

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