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Laser-Induced Metal Deposition and Laser Cutting Techniques for Fixing IC DesignErrors

机译:激光诱导金属沉积和激光切割技术修复IC设计错误

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摘要

The local modification of an integrated circuit (IC) requires in general theavailability of three generic processes. First a method for cutting conductors must be provided. Second, a process for depositing new conductors must be available. Finally, a means of opening via holes through the chip passivation to the underlying conductors is needed; this operation enables newly deposited conductors to make connections to the existing circuit elements, and also provides probe to facilitate testing of the circuit. In this paper we present laser-based techniques that perform these three functions, and describe the operation of a versatile tool that we have constructed and applied to the repair of ICs.

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