• 主题
高级搜索  >
历史搜索 清空历史
首页> 美国政府科技报告 >Micromechanical Sensor for the Spectral Decomposition of Acoustic Signals
【24h】

Micromechanical Sensor for the Spectral Decomposition of Acoustic Signals

机译：用于声信号频谱分解的微机械传感器

获取原文
页面导航
  • 摘要
  • 著录项
  • 相似文献
  • 相关主题

摘要

This technical report is duplicative documentation of the approved doctorial thesis of one of the co-authors. The research was funded in part by the U.S. Army Aviation and Missile Research, Development, and Engineering Center (AMRDEC) for the development of micromechanical sensors under the Army Technology Objective (ATO) of Sensor, Warhead, and Fuzing Technology Integrated for Combined Effects (SWFTICE). Particular technical progress at AMRDEC within this report includes resonant array processing (Chapter 3), electrets integration with Microelectromechanical Systems (MEMS) with localized heater fabrication for wafer bonding and microcharging grids for in-situ charging using microcoronas (Chapter 4), and processing of MEMS transducers (Chapter 5).

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱：kefu@zhangqiaokeyan.com

京公网安备：11010802029741号 ICP备案号：京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有

  • 客服微信

  • 服务号