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Adhesive Bond and Composite Strength Screening System Developmental Study

机译：粘接剂和复合强度筛选系统的发展研究

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This report summarizes the results from an eighteen-month developmental study of an adhesive bond and composite strength screening system. A system based on the utilization of a high power ultrasonic (HPU) technique was developed. Several bonded structures: metal-to-metal, composite-to-composite, composite-to-metal, and composite-to-honeycomb core structures, were fabricated with various bonding conditions for system evaluation. The HPU power levels required to disrupt weak bonds without damaging good bonds in these structures were established. The ability of the system to screen weak bonds in some selected structures was successfully demonstrated. Analytical studies of HPU effects on bonded structures were also conducted. Further improvements and developments of the system are re commended and discussed.

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