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A Synergistic Solution to the Problem of Packaging and Interconnecting VLSI/VHSIC Chips

机译：包装和互连VLsI / VHsIC芯片问题的协同解决方案

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Solutions are required for the many problems faced by the chip packaging and interconnection systems industry for effectively meting the demanding application requirements of the rapidly emerging very-large scale integration/very-high speed integrated circuits (VLSI/VHSIC) chips. Present packaging technologies are being stretched beyond their original concepts thus requiring a new approach to the problem solution. The Military Electronics Systems Operations (MESO) has developed a new packaging approach, based on the Direct Bond Copper Process, which addressed these problems providing a completely integrated system. The problem solution starts at the chip level where en masse connections are made to the chip, chip heat is more effectively managed, low-cost chip hermetic seals accomplished, and then continues providing improved means for interconnecting many VLSI/VHSIC chips. (Author)

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作者
Gioia, J. C.;
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年度 1982
页码 p.1-33
总页数 33
原文格式 PDF
正文语种 eng
中图分类工业技术;
关键词
Chips(Electronics); Circuit interconnections; Integrated circuits; Packaging; Semiconductor devices; Problem solving; Solutions(General); Bonding; Synergism; Soldering; Hermetic seals; Input output devices; Integrated systems; Electronic equipment; Military operat;

机译：芯片（电子）;电路互连;集成电路;封装;半导体器件;解决问题;解决方案（综合）;粘接;协同作用;焊接;气密密封;输入输出设备;集成系统;电子设备;军事操作;

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3. Laser repair of faulty packaged VLSI chips [J] . Boyd I.W., Nolan A.J. Electronics Letters . 1988,第24期

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A Synergistic Solution to the Problem of Packaging and Interconnecting VLSI/VHSIC Chips

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