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Expert System for Design of Plastic Integrated Circuit Packages Against Latent Moisture Induced Defects. Phase II

机译：塑料集成电路封装设计专家系统防止潜在水分引起的缺陷。第二阶段

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This program examined the feasibility of developing a model for predicting cracking of plastic integrated circuit packages. It was demonstrated that moisture induced hydro-thermal stresses during soldering operations can cause plastic package cracking or 'pop coming.' A crack propagation model was developed using fracture mechanics parameters coupled with hydrostatic stresses. Selected plastic packages were characterized using the developed model and segregated according to crack susceptibility during a solder reflow process. Model results compared favorably with laboratory testing on actual parts. Also developed was a computer based expert system that incorporates the crack prediction model.

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作者
Kuo, A. ; Nguyen, L. T. ; Chen, K.;
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年度 1998
页码 1-176
总页数 176
原文格式 PDF
正文语种 eng
中图分类工业技术;
关键词
Predictions; Integrated circuits; Crack propagation; Packaging; Expert systems; Moisture; Laboratory tests; Models; Parameters; Cracks; Fracture(Mechanics); Defects(Materials); Hydrostatics; Flow; Plastics; Thermal stresses; Soldering; Dormancy;

机译：预测;集成电路;裂纹扩展;包装;专家系统;水分;实验室测试;模型;参数;裂缝;断裂（力学）;缺陷（材料）;静水学;流动;塑料;热应力;焊接;休眠;

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专利

1. An expert system for integrated protection design with configurable distribution circuits. II [J] . Thompson J.C., Broadwater R.P. IEEE Transactions on Power Delivery . 1994,第2期

机译：具有可配置配电电路的集成保护设计专家系统。 II
2. FAILURE CRITERION FOR MOISTURE-SENSITIVE PLASTIC PACKAGES OF INTEGRATED CIRCUIT (IC) DEVICES - APPLICATION OF VON-KARMANS EQUATIONS WITH CONSIDERATION OF THERMOELASTIC STRAINS [J] . Suhir E. International Journal of Solids and Structures . 1997,第23期

机译：集成电路设备中对水分敏感的塑料包装的破坏准则-考虑热弹性应变的Von-Karmans方程的应用
3. A contribution to the design of plastic packages for high voltagepower integrated circuits [J] . Albertini M., Bozzo R., Tiziani R. IEEE Transactions on Components, Packaging, and Manufacturing Technology. Part B, Advanced Packaging . 1994,第4期

机译：对高压电源集成电路塑料封装设计的贡献
4. Simulation of moisture-induced plasticization in transfer-molded optical sensor packages using a time - temperature - moisture concentration superposition [C] . Fabian Huber, Harald Etschmaier, Peter Hadley IEEE Electronic Components and Technology Conference . 2021

机译：使用时间温度 - 水分浓度叠加模拟转印模制光学传感器封装中的水分诱导的塑化
5. Silicon germanide/CMOS millimeter-wave integrated circuits and wafer-scale packaging for phased array systems [D] . Min, Byungwook 2008

机译：硅锗化物/ CMOS毫米波集成电路和相控阵系统的晶圆级封装
6. Quantitative comparison of wideband low-latency phase-locked loop circuit designs for high-speed frequency modulation atomic force microscopy [O] . Kazuki Miyata, Takeshi Fukuma 2018

机译：高速调频原子力显微镜的宽带低延迟锁相环电路设计的定量比较
7. Investigation of plastic package related failure mechanisms in plastic encapsulated integrated circuits [O] . Troop Nicholas M. 1996

机译：塑料封装集成电路中与塑料封装相关的失效机理研究

Expert System for Design of Plastic Integrated Circuit Packages Against Latent Moisture Induced Defects. Phase II

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