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Evaluation of no-clean solder process designed to eliminate the use of ozone-depleting chemicals

机译：评估免清洗焊接工艺，旨在消除使用消耗臭氧层的化学品

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This paper summarizes the LANL contributions to a joint Motorola/SNLA/LANL cooperative research and development agreement study on the reliability of an alternative solder process that is intended to reduce or eliminate the use of ozone-depleting chemicals in the manufacture of printed wire boards (PWBs). This process is termed self-cleaning because of the nature of the thermal chemistry associated with the adipic and formic acid components used in place of traditional solder rosin fluxes. Traditional rosin fluxes used in military electronic hardware applications are cleaned (by requirement) using chlorofluorohydrocarbons. The LANL contribution centers around analytical determination of PWB cleanliness after soldering using the self-cleaning method. Results of these analytical determinations involving primarily surface analysis of boards following temperature, temperature and humidity, and long-term storage testing are described with representative data. It is concluded that the self-cleaning process leaves behind levels of solid residue that are visually and analytically observable using most of these surface analysis techniques. The materials compatibility of electronic components soldered using the self-cleaning soldering process is more fully described in the project report issued by SNLA that encompasses the complete project with statistical lifetime and accelerated aging studies. Analytical surface specificity and suggestions for further work are also given.

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