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Creep of Two-Phase Microstructures for Microelectronic Applications

机译:用于微电子应用的两相微结构的蠕变

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The mechanical properties of low-melting temperature alloys are highly influenced211u001eby their creep behavior. This study investigates the dominant mechanisms that 211u001econtrol creep behavior of two-phase, low-melting temperature alloys as a function 211u001eof microstructure. The alloy systems selected for study were In-Ag and Sn-Bi 211u001ebecause their eutectic compositions represent distinctly different 211u001emicrostructures. The In-Ag eutectic contains a discontinuous phase while the Sn-211u001eBi eutectic consists of two continuous phases. In addition, this work generates 211u001euseful engineering data on Pb-free alloys with a joint specimen geometry that 211u001esimulates microstructures found in microelectronic applications.

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