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Consortium Dealing With Reliability and Packaging Roadblocks to the Commercialization of Microsystems

机译：联盟处理微系统商业化的可靠性和封装障碍

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作者
Hartley, F.;
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年度 1998
页码 1-2
总页数 2
原文格式 PDF
正文语种 eng
中图分类工业技术;
关键词
COMMERCIALIZATION; MICROELECTROMECHANICAL SYSTEMS; MICROSTRUCTURE; ORGANIZATIONS; PACKAGING; RELIABILITY; ROBOTICS; commercialization MEMS devices microstructures robotic spacecraft;

机译：商业化;微电子机械系统;组织;组织;打包;可靠性; ROBOTICs;商业化mEms器件微结构机器人航天器;

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Consortium Dealing With Reliability and Packaging Roadblocks to the Commercialization of Microsystems

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