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首页> 美国政府科技报告 >Semiconductor Measurement Technology: Nondestructive Tests Used to Insure the Integrity of Semiconductor Devices, with Emphasis on Acoustic Emission Techniques
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Semiconductor Measurement Technology: Nondestructive Tests Used to Insure the Integrity of Semiconductor Devices, with Emphasis on Acoustic Emission Techniques

机译：半导体测量技术：用于确保半导体器件完整性的无损检测，重点是声发射技术

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The discussion is divided into two major sections. The first consists of an introduction to device assembly techniques and problems followed by a review of six important nondestructive tests used during and after device packaging to insure the mechanical integrity of completed electronic devices. Most of these tests are called out in the military testing standard, MIL-STD-883 and are generally classified as screens. The first section concludes with a brief introduction to the economic and other factors that result in the choice of one screen over another and to production line statistical sampling (LTPD) appropriate to special high reliability device lots such as those used for space flight. The second section begins with an introduction to acoustic emission, the status of theory as it can be applied to microelectronics. Then the published papers that have applied AE as a nondestructive test in electronics applications will be reviewed. Finally, passive AE techniques are applied to establishing the mechanical bond integrity of beam lead, flip chip, and tape-bonded integrated circuits as well as components in hybrid microcircuits.

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