Fully-integrated MEMS gaskets and O-rings made of SU8udand photosensitive silicone are described and tested underudvarying conditions of compressive stress. An analyticaludtheory of microgasket sealing behavior is also presented. The theory shows the critical importance of device surfaceudflatness. The microgasket is found to be capable ofuddeforming approximately 25% of its initial thickness andudforming leak-free fluidic seals at inlet pressures below 50 psi. The microgasket is incorporated into a modular microfluidic system that exhibits system leak rates lower than 2.3 nL/min for working pressures up to 250 psi. Fabricated chip-to-chip interconnects exhibit a low dead volume of approximately 9 nL while further optimization can reduce dead volume per interconnect to about 1 nL.
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