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>Fabrication of microelectrodes deeply embedded in LiNbO3 using a femtosecond laser
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Fabrication of microelectrodes deeply embedded in LiNbO3 using a femtosecond laser
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机译：飞秒激光制备深嵌入LiNbO 3 的微电极
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摘要
We present a novel technique to fabricate deeply embedded microelectrodes in LiNbO3 using femtosecond pulsed laser ablation and selective electroless plating. The fabrication process mainly consists of four steps, which are (1) micromachining of microgrooves on the surface of LiNbO3 by femtosecond laser ablation; (2) formation of AgNO3 films on substrates; (3) scanning the femtosecond laser beam in the fabricated microgrooves for modi. cation of the inner surfaces; and (4) electroless copper plating. The void-free electroless copper plating is obtained with appropriate cross section of microgrooves and uniform initiation of the autocatalytic deposition on the inner surface of grooves. The dimension and shape of the microelectrodes could be accurately controlled by changing the conditions of femtosecond laser ablation, which in turn can control the distribution of electric field inside LiNbO3 crystal for various applications, opening up a new approach to fabricate three-dimensional integrated electro-optic devices. (C) 2008 Elsevier B. V. All rights reserved.
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机译：我们提出了一种新技术，以使用飞秒脉冲激光烧蚀和选择性化学镀在LiNbO3中制造深埋微电极。该制造过程主要包括四个步骤，即：（1）飞秒激光烧蚀LiNbO3表面的微细槽。 （2）在基板上形成AgNO 3膜； （3）在制造的微槽中扫描飞秒激光束进行修改。内表面阳离子； （4）化学镀铜。获得具有适当横截面的微沟槽和均匀引发沟槽内表面上的自催化沉积的无孔化学镀铜。通过改变飞秒激光烧蚀的条件，可以精确地控制微电极的尺寸和形状，从而可以控制LiNbO3晶体内部的电场分布以用于各种应用，从而开辟了一种制造三维集成电电极的新方法。光学设备。 （C）2008 Elsevier B. V.保留所有权利。
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