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The effect of sulfanilamide on the electrodeposition of copper onto a single crystal copper (100) plane and a polycrystalline copper substrate

机译：磺胺对铜在单晶铜（100）面和多晶铜基底上电沉积的影响

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Studies were made of the electrodeposition of Cu onto a single-crystal Cu(100) plane and onto a polycryst. Cu surface both in pure acidic CuSO4 soln. and in solns. contg. various concns. of sulfanilamide at various c. ds. the transition is from pyramids to truncated blocks to ridges and then to a polycryst. deposit. On a polycryst. substrate there is a change from large grains to very fine grains in the presence of sulfanilamide. These changes are explained with the help of complexation and adsorption theory.

机译：研究了将Cu电沉积到单晶Cu（100）平面和多晶上的研究。铜表面均在纯酸性CuSO4溶液中。和在solns中。续各种conns。在各种条件下的磺胺含量ds。过渡是从金字塔到截断的块再到山脊，再到多晶。存款。在聚合晶体上。在磺胺的存在下，从大颗粒到非常细的颗粒都有变化。借助络合和吸附理论解释了这些变化。

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Subramanian K.; Nageswar S.;
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年度 1980
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1. Kinetic Monte Carlo simulation of the electrodeposition of polycrystalline copper: Effects of substrates and deposition parameters on the microstructure of deposits [J] . Jun Liu, Changqing Liu, Paul P. Conway Electrochimica Acta . 2013,第Null期

机译：多晶铜电沉积的动力学蒙特卡洛模拟：衬底和沉积参数对沉积物微观结构的影响
2. SYNTHESIS, CHARACTERIZATION, AND SINGLE-CRYSTAL EPR STUDIES OF THREE DINUCLEAR COPPER(II) COMPLEXES AND ONE MIXED-VALENCE TETRANUCLEAR COPPER(I)-COPPER(II) CLUSTER WITH AN ASYMMETRIC IMIDAZOLE-CONTAINING TRIPODAL LIGAND WITH COPPER(II)-COPPER(II) DIS [J] . Koolhaas GJAA., Reedijk J., Vanderplas JL., Inorganic Chemistry: A Research Journal that Includes Bioinorganic, Catalytic, Organometallic, Solid-State, and Synthetic Chemistry and Reaction Dynamics . 1996,第6期

机译：含不对称咪唑的含三键铜配位配铜配体的三核铜（II）配合物和一价四价铜（I）-铜（II）簇的合成，表征和单晶EPR研究II）DIS
3. Copper oxides: kinetics of formation and semiconducting properties. Part I. Polycrystalline copper and copper-gold alloys [J] . A. Vvedenskii, S. Grushevskaya, S. Ganzha, Journal of solid state electrochemistry . 2014,第10期

机译：铜氧化物：形成动力学和半导体性能。第一部分：多晶铜和铜金合金
4. NANOSTRUCTURING OF POLYCRYSTALLINE AND SINGLE CRYSTAL GOLD ELECTRODES BY COPPER ELECTRODEPOSITION USING IN SITU SPM METHODS [C] . Th. Schimmel, W. J. Lorenz International Symposium on Scanning Probe Techniques for Materials Characterization at Nanometer Scale . 2001

机译：用原位SPM方法通过铜电沉积多晶和单晶金电极的纳米结构
5. AN INVESTIGATION OF THE PHOTOELECTRIC THRESHOLD, WORK FUNCTION AND BULK FERMI LEVEL OF SINGLE-CRYSTAL CUPROUS-OXIDE, AND THE PHOTOVOLTAIC PROPERTIES OF SINGLE-CRYSTAL AND POLYCRYSTALLINE CUPROUS-OXIDE - COPPER CONTACTS. [D] . ASSIMOS, JOHN ANTHONY. 1973

机译：单晶氧化铜的光电阈值，工作功能和本体费米能级的研究，以及单晶和多晶氧化铜-铜接触的光电特性。
6. Nano-scale machining of polycrystalline coppers - effects of grain size and machining parameters [O] . Jing Shi, Yachao Wang, Xiaoping Yang 2013

机译：纳米级多晶铜加工-晶粒尺寸和加工参数的影响
7. Electrodeposition of copper on a copper single-crystal (100) face and on a copper polycrystalline surface in the presence of sulphaguanidine [O] . Subramanian K., Nageswar S. 1979

机译：在硫酸胍存在下在铜单晶（100）面和铜多晶表面上电沉积铜
8. Differences in Fatigue Behavior of Single Copper Crystals and Polycrystalline Copper at Elevated Temperatures [R] . Wood, W. A., Nine, H. D. 1965

机译：单晶铜和多晶铜在高温下疲劳行为的差异

The effect of sulfanilamide on the electrodeposition of copper onto a single crystal copper (100) plane and a polycrystalline copper substrate

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