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Flip-chip using integrated cavity filter, and related components, systems and methods
Flip-chip using integrated cavity filter, and related components, systems and methods
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机译：使用集成腔滤波器的倒装芯片以及相关组件，系统和方法
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摘要
A flip-chip using an integrated cavity filter comprising an integrated circuit (IC) chip comprising a semiconductor die and a plurality of conductive bumps is disclosed. The plurality of conductive bumps are interconnected to at least one metal layer of the semiconductor die to provide a conductive “fence” defining an internal resonator cavity for providing a cavity filter integrated in a flip-chip. The internal resonator cavity is configured to receive the input RF signal from the input transmission line through an input signal transmission aperture provided in the inner layer of the semiconductor die. The internal resonator cavity resonates the input RF signal to produce an output RF signal including the filtered RF signal of the input RF signal, and on the output signal transmission line of the flip-chip through the output transmission aperture provided to the aperture layer. The output RF signal is coupled.
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