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Suppressing sin removal rates and reducing oxide trench dishing for shallow trench isolation (sti) process
Suppressing sin removal rates and reducing oxide trench dishing for shallow trench isolation (sti) process
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机译:抑制罪恶去除率并减少用于浅沟槽隔离(STI)工艺的氧化物沟槽凹陷
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摘要
Present invention provides Chemical Mechanical Planarization Polishing (CMP) compositions for Shallow Trench Isolation (STI) applications. The CMP compositions contain ceria coated inorganic oxide particles as abrasives, such as ceria-coated silica particles; chemical additive selected from the group consisting of an organic acetylene molecule containing an acetylene bond and at least two or multi ethoxylate functional groups with terminal hydroxyl groups, an organic molecule with at least two or multi hydroxyl functional groups in the same molecule, and combinations thereof; water soluble solvent; and optionally biocide and pH adjuster; wherein the composition has a pH of 2 to 12, preferably 3 to 10, and more preferably 4 to 9.
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