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Suppressing sin removal rates and reducing oxide trench dishing for shallow trench isolation (sti) process

机译:抑制罪恶去除率并减少用于浅沟槽隔离(STI)工艺的氧化物沟槽凹陷

摘要

Present invention provides Chemical Mechanical Planarization Polishing (CMP) compositions for Shallow Trench Isolation (STI) applications. The CMP compositions contain ceria coated inorganic oxide particles as abrasives, such as ceria-coated silica particles; chemical additive selected from the group consisting of an organic acetylene molecule containing an acetylene bond and at least two or multi ethoxylate functional groups with terminal hydroxyl groups, an organic molecule with at least two or multi hydroxyl functional groups in the same molecule, and combinations thereof; water soluble solvent; and optionally biocide and pH adjuster; wherein the composition has a pH of 2 to 12, preferably 3 to 10, and more preferably 4 to 9.
机译:本发明提供了用于浅沟槽隔离(STI)应用的化学机械平坦化抛光(CMP)组合物。 CMP组合物包含二氧化铈涂覆的无机氧化物颗粒作为磨料,例如二氧化铈涂覆的二氧化硅颗粒;和选自以下的化学添加剂:包含乙炔键的有机乙炔分子和具有末端羟基的至少两个或多个乙氧基化官能团,同一分子中具有至少两个或多个羟基官能团的有机分子及其组合;水溶性溶剂;以及可选的杀菌剂和pH调节剂;其中所述组合物的pH为2至12,优选3至10,并且更优选4至9。

著录项

  • 公开/公告号IL270237D0

    专利类型

  • 公开/公告日2020-04-30

    原文格式PDF

  • 申请/专利权人 VERSUM MATERIALS US LLC;

    申请/专利号IL20190270237

  • 发明设计人

    申请日2019-10-28

  • 分类号C09G;

  • 国家 IL

  • 入库时间 2022-08-21 11:17:14

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