首页> 外国专利> BRANCH CIRCUIT THERMAL MONITORING SYSTEM FOR CONTINUOUS TEMPERATURE MONITORING BY DIRECTLY APPLIED SENSORS

BRANCH CIRCUIT THERMAL MONITORING SYSTEM FOR CONTINUOUS TEMPERATURE MONITORING BY DIRECTLY APPLIED SENSORS

机译:直接应用传感器的连续温度监测的分支电路热监测系统

摘要

A branch circuit thermal monitoring system comprises a housing and an electrical power distribution sub-system. The housing includes a plurality of thermal modules each connected with a thermal sensor assembly of a plurality of thermal sensor assemblies. The housing further includes a module rack wherein each of the thermal modules is installed on the module rack. The housing further includes a main controller configured to communicate with the thermal modules. The thermal modules are configured for individually monitoring corresponding identified connection points of interest with the attached thermal sensor assemblies such that the thermal modules and the thermal sensor assemblies provide continuous temperature monitoring of the corresponding identified connection points of interest. The thermal sensor assembly is configured to be directly applied to a connection point of interest thus avoiding any additional mounting assembly. The electrical power distribution sub-system is coupled to the thermal modules.
机译:分支电路热监控系统包括外壳和配电子系统。壳体包括多个热模块,每个热模块与多个热传感器组件中的热传感器组件连接。壳体还包括模块架,其中每个热模块被安装在模块架上。壳体还包括被配置为与热模块通信的主控制器。热模块被配置为用于单独地监视与附接的热传感器组件的相应的所识别的感兴趣的连接点,使得热模块和热传感器组件提供对相应的所识别的所关注的连接点的连续温度监视。热传感器组件配置为直接应用于感兴趣的连接点,从而避免了任何其他安装组件。配电子系统耦合到热模块。

著录项

  • 公开/公告号US2020064201A1

    专利类型

  • 公开/公告日2020-02-27

    原文格式PDF

  • 申请/专利权人 SIEMENS INDUSTRY INC.;

    申请/专利号US201816111602

  • 发明设计人 AMIT NAYAK;MATTHEW LEIDY;

    申请日2018-08-24

  • 分类号G01K1/02;G01K3;

  • 国家 US

  • 入库时间 2022-08-21 11:21:04

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