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Techniques Providing Metal Gate Devices with Multiple Barrier Layers

机译:为金属栅器件提供多层阻挡层的技术

摘要

A semiconductor device with a metal gate is disclosed. An exemplary semiconductor device with a metal gate includes a semiconductor substrate, source and drain features on the semiconductor substrate, a gate stack over the semiconductor substrate and disposed between the source and drain features. The gate stack includes a HK dielectric layer formed over the semiconductor substrate, a plurality of barrier layers of a metal compound formed on top of the HK dielectric layer, wherein each of the barrier layers has a different chemical composition; and a stack of metals gate layers deposited over the plurality of barrier layers.
机译:公开了一种具有金属栅极的半导体器件。具有金属栅极的示例性半导体器件包括半导体衬底,在半导体衬底上的源极和漏极部件,在半导体衬底上方并且设置在源极和漏极部件之间的栅极叠层。栅极堆叠包括形成在半导体衬底上方的HK介电层,形成在HK介电层顶部的金属化合物的多个阻挡层,其中每个阻挡层具有不同的化学组成;以及沉积在多个阻挡层上方的金属栅层的堆叠。

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