Molded Interconnect Microelectromechanical Systems (MEMS) Device Package

• 1. 模制成型的互连微机电系统(MEMS)装置封装体 [P] . 中国专利： CN109417673A . 2019-03-01
• 2. 用于封装MEMS器件的封装结构、MEMS芯片及微执行器 [P] . 中国专利： CN109467042A . 2019-03-15
• 3. MOLDED INTERCONNECT MICROELECTROMECHANICAL SYSTEM (MEMS) DEVICE PACKAGE [P] . 欧洲知识产权局专利： EP3443760A4 . 2019-12-11

  机译： 模压互连微机电系统（MEMS）器件包装

• 4. MOLDED INTERCONNECT MICROELECTROMECHANICAL SYSTEM (MEMS) DEVICE PACKAGE [P] . 欧洲知识产权局专利： EP3443760A1 . 2019-02-20

  机译： 模压互连微机电系统（MEMS）器件包装

• 5. MOLDED INTERCONNECT MICROELECTROMECHANICAL SYSTEM (MEMS) DEVICE PACKAGE [P] . 世界知识产权组织专利： WO2017180858A1 . 2017-10-19

  机译： 模压互连微机电系统（MEMS）器件包装

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• 3. Microelectromechanical Systems (MEMS) Resistive Heaters as Circuit Protection Devices [J] . Coutu R.A., Ostrow S.A. Components, Packaging and Manufacturing Technology, IEEE Transactions on . 2013,第12期
• 4. MRI contrast using solid-state, B1-distorting, microelectromechanical systems (MEMS) microresonant devices (MRDs). [J] . Ciocan R, Lenkinski RE, Bernstein J, Magnetic resonance in medicine: official journal of the Society of Magnetic Resonance in Medicine . 2009,第4期
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• 7. Nonlinear control of microelectromechanical systems (MEMS) devices. [D] . Owusu, Kwadwo Osei. 2006
• 8. Novel First-Level Interconnect Techniques for Flip Chip on MEMS Devices [O] . Jemmy Sutanto, Sindhu Anand, Chetan Patel, -1
• 9. A Multilayer Process for 3D-Molded-Interconnect-Devices to Enable the Assembly of Area-Array Based Package Types [O] . T. Leneke, S. Hirsch 2009
• 10. Aerospace Sensor Component and Subsystem Investigation and Innovation-2 Component Exploration and Development (ASCSII-2 CED) Delivery Order 0003: Hermetically Sealed Cavities in 3-D GaAs-Silicon and Silicon-Silicon Packages for Microelectromechanical System (MEMS) Devices Using Selective and Large-Scale Bonding [R] . Malshe, A. P. 2003

• 1. Review of flexible microelectromechanical system sensors and devices [J] . Xiaopeng Yang ,Menglun Zhang . 纳米技术与精密工程 . 2021,第002期
• 2. Preparation and Characterization of DLC Films by Twinned ECR Microwave Plasma Enhanced CVD for Microelectromechanical Systems (MEMS) Applications [J] . 李新 . 武汉理工大学学报：材料科学英文版 . 2004,第2期
• 3. Study of Weak Acid Preservatives and Modified Atmosphere Packaging (MAP) on Mold Growth in Modal Agar System [J] . Salah M. Hasan ,Ramadan A. Abdolgader . 食品与营养科学（英文） . 2012,第6期
• 4. 微机电系统(MEMS)与微机械惯性器件 [C] . 吕志清 . 中国电子学会第十一届电子元件学术年会 . 2000
• 5. BGA封装器件间互连的信号完整性分析和测试方法研究 [A] . 石光耀 . 2013