SOLDER ALLOY FOR PREVENTING FE EROSION, RESIN FLUX CORED SOLDER, WIRE SOLDER, RESIN FLUX CORED WIRE SOLDER, FLUX COATED SOLDER, SOLDER JOINT AND SOLDERING METHOD

• 1. 药芯焊丝、使用了药芯焊丝的焊接方法、使用了药芯焊丝的焊接接头的制造方法以及焊接接头 [P] . 中国专利： CN104955610B . 2016.09.07
• 2. 药芯焊丝、使用了药芯焊丝的焊接方法、使用了药芯焊丝的焊接接头的制造方法以及焊接接头 [P] . 中国专利： CN104955610A . 2015-09-30
• 3. Solder alloy for preventing Fe erosion, resin flux cored solder, wire solder, resin flux cored wire solder, flux coated solder, solder joint and soldering method [P] . 美国专利： US10717158B2 . 2020.07.21
• 4. SOLDER ALLOY FOR PREVENTING FE EROSION, RESIN FLUX CORED SOLDER, WIRE SOLDER, RESIN FLUX CORED WIRE SOLDER, FLUX COATED SOLDER, SOLDER JOINT AND SOLDERING METHOD. [P] . MX369306B . 2019-11-05

  机译： 用于防止铁腐蚀的焊锡合金，树脂药芯焊丝，焊丝，树脂药芯焊丝，药芯焊丝，焊点和焊锡方法。

• 5. SOLDER ALLOY FOR PREVENTING FE EROSION, RESIN FLUX CORED SOLDER, WIRE SOLDER, RESIN FLUX CORED WIRE SOLDER, FLUX COATED SOLDER, SOLDER JOINT AND SOLDERING METHOD [P] . PT3369520T . 2019-09-23

  机译： 用于防止铁腐蚀的焊锡合金，树脂药芯焊丝，焊丝，树脂药芯焊丝，药芯焊丝，焊点和焊锡方法

• 1. Mechanical properties of QFP micro-joints soldered with lead-free solders using diode laser soldering technology [J] . HAN Zong-jie, XUE Song-bai, WANG Jian-xin, 中国有色金属学报（英文版） . 2008,第004期
• 2. Effects of rapid solidification process and 0.1Pr/Nd addition on characteristics of Sn-9Zn solder alloy and interfacial properties of Cu/solder/Cu joints [J] . 赵国际, 光华, 盛光敏, 中南大学学报（英文版） . 2016,第008期
• 3. Parameter fitting of constitutive model and FEM analysis of solder joint thermal cycle reliability for lead-free solder Sn-3.5Ag [J] . ZHOU Ping, HU Bing-ting, ZHOU Jie-min, 中南大学学报（英文版） . 2009,第003期
• 4. Solder alloys and soldering processes for flux-free soldering of difficult-to-wet materials [J] . Frank Hillen, Dagmar Pickart-Castillo, Ino J. Rass, Schweissen & Schneiden . 2000,第8期
• 5. The effects of solder deformation on the wetting characteristics and interfacial reaction of Sn-3.5Ag solders on Cu substrates in fluxless soldering [J] . Jeong Hwan Lee, Sung Woo Ma, Young Min Kim, Journal of materials science . 2013,第9期
• 6. M35 & M20 NEO Resin Flux Cored Solders [J] . Asia electronics industry . 2013,第4期
• 7. Parylene conformal coating compatibility evaluation with no-clean solder pastes, wave solder fluxes and flux cored wire solders [C] . Alvin Schneider, Karen Tellefsen, Joseph Yira NEPCON west technical program conference and exhibition . 1999
• 8. Sensitizing resin acids in aerosol derived from rosin flux used in electronics soldering: Molecular mechanistic studies in resin acid/protein hapten formation [D] . Smith, Philip Addison 1998
• 9. Occupational asthma in a factory making flux-cored solder containing colophony. [O] . P S Burge, G Edge, R Hawkins, 1981
• 10. Preparation and Study of Flux used for Lead-free Flux-cored Wire and Composite Powder Solder Paste [O] . 陈梁 2011

• 1. Effects of rapid solidification process and 0.1Pr/Nd addition on characteristics of Sn-9Zn solder alloy and interfacial properties of Cu/solder/Cu joints [J] . 赵国际12 ,文光华1 ,盛光敏1 . 中南大学学报 . 2016,第008期
• 2. Parameter fitting of constitutive model and FEM analysis of solder joint thermal cycle reliability for lead-free solder Sn-3.5Ag [J] . 周萍 ,胡炳亭 ,周孑民 . 中南大学学报 . 2009,第003期
• 3. 高强钢用实芯焊丝与药芯焊丝熔敷金属工艺性试验对比研究 [C] . 吴晓玲 . 2017中国焊接产业论坛 . 2017
• 4. 5CrNiMo热作模修复用金属芯药芯焊丝及其堆焊层性能研究 [A] . 李昱 . 2017