Gazette forming mechanism, Gazette forming method, end sealing device, and packaging machine

• 1. 业务处理方法及因公报销处理方法 [P] . 中国专利： CN111402026B . 2022.01.25
• 2. 一种对公报账处理方法、装置、存储介质和电子设备 [P] . 中国专利： CN113962640A . 2022-01-21
• 3. GAZETTE MOLDING MECHANISM, TOP SEAL DEVICE, PACKAGING MACHINE, GAZETTE MOLDING METHOD, TOP SEAL METHOD, PACKAGING METHOD [P] . 日本专利： JP2017128382A . 2017-07-27

  机译： 瞪羚成型机制，顶密封装置，包装机，瞪羚成型方法，顶密封方法，包装方法

• 4. PATENT GAZETTE INFORMATION OUTPUT DEVICE, PATENT GAZETTE INFORMATION OUTPUT METHOD, AND PROGRAM [P] . 日本专利： JP2013008240A . 2013-01-10

  机译： 专利公报信息输出设备，专利公报信息输出方法和程序

• 5. GAZETTE BAG HAVING DIAMOND-SHAPED BOTTOM SURFACE AND TRUNK PART, PRODUCTION METHOD THEREOF, AND GAZETTE PART FORMATION DEVICE USED IN THE PRODUCTION METHOD [P] . 日本专利： JP2013006394A . 2013-01-10

  机译： 具有菱形底部表面和后备箱部件的加泽特袋，其制造方法以及在该制造方法中使用的加泽特部件形成装置

• 1. The Bridge of Chinese and Western Information Exchange in the 19th Century—The Translation of Peking Gazette from North-China Herald Office [J] . ZHAO Ying 文学与艺术研究：英文版 . 2020,第012期
• 2. Preface to the Special Issue on Atmospheric Oxidation Capacity, Ozone, and PM2.5 Pollution: Quantification Methods, Formation Mechanisms, Simulation, and Control [J] . Yuesi WANG, Zirui LIU 大气科学进展（英文版） . 2021,第007期
• 3. A practical method for predicting gold-wire deformation in transfer molding process of semiconductor devices. Part III: formulation of common parameters applicable to a BGA package and a QFP [J] . Saeki Junichi, Yoshida Isamu, Houzouji Hiroshi 成形加工: プラスチツク成形加工学会志 . 2001,第1期
• 4. A practical method for predicting gold-wire deformation in transfer molding process of semiconductor devices. Part III: formulation of common parameters applicable to a BGA package and a QFP [J] . Saeki Junichi, Yoshida Isamu, Houzouji Hiroshi 成形加工: プラスチツク成形加工学会志 . 2001,第1期
• 5. A practical method for predicting gold-wire deformation in transfer molding process of semiconductor devices. Part I: analysis of a BGA package having gold wires with uniform dimensions [J] . Saeki Junichi, Yoshida Isamu, Houzouji Hiroshi 成形加工: プラスチツク成形加工学会志 . 2000,第1期
• 6. Conformal, Hermetic Micro-packaging using Indium and Silver for Sealing High Power MEMS Devices [C] . Gustina B. Collins, Guo-Quan Lu, Sanjay Raman Annual Power Electronics Conference at Virginia TECH; 20050417-20; Blacksburg,VA(US) . 2005
• 7. Text and Context: The "Beiyang Gazette" and the Beiyang Reform of the Late Qing Dynasty. [D] . Jiang, Hailong. 2012
• 8. Swine Small Intestine Sealing Performed by Different Vessel Sealing Devices: Ex-Vivo Test [O] . Luca Lacitignola, Annarita Imperante, Rodrigo Trisciuzzi, 2021
• 9. A Practical Method for Predicting Gold-Wire Deformation in Transfer Molding Process of Semiconductor Devices. Part I: Analysis of a BGA Package having Gold Wires with Uniform Dimensions. [O] . Junichi Saeki, Isamu Yoshida, Hiroshi Houzouji 2000

• 1. Forming Mechanism of Gaseous Defect in Ti-48Al-2Cr-2Nb Exhaust Valves Formed with Permanent Mold Centrifugal Casting Method [J] . Research Notes Wenbin SHENG Jingjie GUO Yanqing SU Hongsheng DING and Jun JIA School of Materials Science and Engineering Harbin Institute of Technology. Harbin 150001 China . 材料科学技术：英文版 . 2001,第5期
• 2. Effect of different processing methods for the hole transporting layer on the performance of double layer organic light-emitting devices [J] . SU0 Fan YUJun-sheng DENG Jing LOUShuang-ling JIANGYa-dong . 光电子快报：英文版 . 2007,第4期
• 3. A review of β-Ga_2O_3 single crystal defects, their effects on device performance and their formation mechanism [J] . Bo Fu ,Zhitai Jia ,Wenxiang Mu . 半导体学报：英文版 . 2019,第1期
• 4. 阮玲玉事件中的大公报人——对比《大公报》与《申报》新闻评论 [C] . 赵翊羽 . 首届长三角影视传媒研究生学术论坛 . 2015
• 5. 抗战胜利前后《大公报》舆论立场转变研究——基于《大公报》与《新华日报》论战分析 [A] . 王晓东 . 2014