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WAFER TRANSFER MECHANISM, WAFER PROBER AND TRANSFER POSITION ADJUSTING METHOD FOR WAFER TRANSFER MECHANISM
WAFER TRANSFER MECHANISM, WAFER PROBER AND TRANSFER POSITION ADJUSTING METHOD FOR WAFER TRANSFER MECHANISM
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机译：晶片转移机理的晶片转移机理，晶片探针和转移位置调整方法
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摘要
To provide a wafer transfer mechanism for positioning a wafer to be placed on a stage by correcting positional displacement of the wafer in a delivery process of the wafer.SOLUTION: A wafer transfer mechanism is configured to deliver a wafer onto a stage which comprises a placement surface and is capable of placing the wafer on the placement surface. The wafer transfer mechanism comprises multiple lift pins each of which is disposed outside of an outer edge of the placement surface of the stage and delivers the wafer at a transfer position at an upper side of the stage by being vertically driven while supporting a rear face of the wafer having a diameter that is larger than the stage. Each of the lift pins includes: a supporting surface which is provided in parallel with the placement surface of the stage and supports the wafer in contact with a rear face of a rim part that is provided in an outer periphery of the wafer; a vertical surface which is positioned outside of the outer edge of the wafer supported on the supporting surface, and provided vertically to the supporting surface; and an inclined surface which is positioned at an upper side of the vertical surface and provided while being inclined upwards from a center of the stage to the outside.SELECTED DRAWING: Figure 1
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