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MAGNETRON SPUTTERING GUN AND MAGNETRON SPUTTERING THIN FILM DEPOSITION APPARATUS

机译:磁控溅射枪和磁控溅射薄膜沉积装置

摘要

To provide a magnetron sputtering gun capable of suppressing a temperature increase in a cathode part of a magnetron sputtering thin film deposition apparatus and not requiring cooling by cooling water to reduce a facility cost, and the magnetron sputtering thin film deposition apparatus using the same.SOLUTION: The above problem was solved by a sputtering gun 10 characterized by heat ballast 13 with a cooling method of a non-water cooling system, the sputtering gun 10 having a shield cover 15, a target holding means 11 for holding a target t, a permanent magnet 12 for generating a magnetic field on a surface of the target t, and cooling means for cooling the target t and the permanent magnet 12.SELECTED DRAWING: Figure 1
机译:提供一种磁控溅射枪以及使用该磁控溅射枪的磁控溅射薄膜沉积设备,该磁控溅射枪能够抑制磁控溅射薄膜沉积设备的阴极部分中的温度升高并且不需要通过冷却水进行冷却以降低设备成本。 :上述问题通过具有以非水冷却系统的冷却方法的热镇流器13为特征的溅射枪10解决,该溅射枪10具有屏蔽罩15,用于保持靶材t的靶材保持装置11,用于在靶材t的表面上产生磁场的永磁体12和用于冷却靶材t和永磁体12的冷却装置。

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