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MAGNETRON SPUTTERING GUN AND MAGNETRON SPUTTERING THIN FILM DEPOSITION APPARATUS
MAGNETRON SPUTTERING GUN AND MAGNETRON SPUTTERING THIN FILM DEPOSITION APPARATUS
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机译:磁控溅射枪和磁控溅射薄膜沉积装置
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摘要
To provide a magnetron sputtering gun capable of suppressing a temperature increase in a cathode part of a magnetron sputtering thin film deposition apparatus and not requiring cooling by cooling water to reduce a facility cost, and the magnetron sputtering thin film deposition apparatus using the same.SOLUTION: The above problem was solved by a sputtering gun 10 characterized by heat ballast 13 with a cooling method of a non-water cooling system, the sputtering gun 10 having a shield cover 15, a target holding means 11 for holding a target t, a permanent magnet 12 for generating a magnetic field on a surface of the target t, and cooling means for cooling the target t and the permanent magnet 12.SELECTED DRAWING: Figure 1
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