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APPLYING DEVELOPING METHOD AND APPLYING DEVELOPING APPARATUS
APPLYING DEVELOPING METHOD AND APPLYING DEVELOPING APPARATUS
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机译：应用开发方法和应用开发装置
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摘要
In developing a resist film containing a metal formed on a surface of a substrate, a resist film is formed by coating a resist containing a metal to a substrate and developing the resist film after exposure, and an object of the present invention is to suppress adhesion of the metal to an end portion surface of the circumference and the peripheral edge portion of the circumference of the back surface of the substrate. The present invention implements: a process of applying a resist (74) containing a metal to the surface of the substrate (W) to form a resist film (71) and exposing the resist film (71); a process of developing the resist film (71) by supplying developing solution (77) to the surface of the substrate; and a process of forming a protection film (72) formed on the peripheral edge of the circumference of the substrate (W) on which the resist film is not formed so as to be in contact with the developing solution (77) at least at the end portion surface of the circumference and the peripheral edge portion of the circumference of the back surface before the developing process.
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