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method for detecting misalignment of chips manufacturing method of fan-out panel level package using the same and fan-out panel level package
method for detecting misalignment of chips manufacturing method of fan-out panel level package using the same and fan-out panel level package
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机译：芯片不对准的检测方法，使用该方法的扇出面板级封装和扇出面板级封装的制造方法
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摘要
The present invention provides a method for detecting an alignment error of chips capable of detecting alignment errors of chips at a high speed, and a manufacturing method of a package using the same. The method comprises the following steps of: scanning a substrate and the chips, and obtaining images; obtaining absolute differences of reference chips with respect to the substrate in the images; obtaining relative differences of dependent chips in the images with respect to the reference chips; and calculating the alignment errors of the chips from the absolute differences and the relative differences.
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