METHOD FOR CLEANING BONDING INTERFACE BEFORE BONDING

• 1. 用接触声非线性定量无损检测粘接界面粘接力的方法 [P] . 中国专利： CN100387982C . 2008.05.14
• 2. 用接触声非线性定量无损检测粘接界面粘接力的方法 [P] . 中国专利： CN1605862A . 2005-04-13
• 3. Method for cleaning bonding interface before bonding [P] . 美国专利： US10618082B2 . 2020-04-14

  机译： 粘接前清洗粘接界面的方法

• 4. In order the methodological null wire bonding device of the wire bonding which uses the bonding wire cleaning device and the same cleaning device which possess [P] . 日本专利： JP4969567B2 . 2012-07-04

  机译： 为了使使用键合线清洁装置的引线键合的方法无效的空线键合装置与具有

• 5. Bonding interface quality by cold cleaning and hot bonding [P] . 美国专利： US7645682B2 . 2010-01-12

  机译： 通过冷清洗和热粘合来粘合界面质量

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• 9. Bond strength of lithium disilicate after cleaning methods of the remaining hydrofluoric acid [O] . D. dos Santos, S. Bitencourt, E. da Silva, 2020

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