Assessment and verification of hardware requirements for multi-stage field programmable gate arrays in airborne electronic systems

• 1. 多层现场可编程门阵列硬件要求评估和验证 [P] . 中国专利： CN104281509B . 2017.11.28
• 2. 多层现场可编程门阵列硬件要求评估和验证 [P] . 中国专利： CN104281509A . 2015-01-14
• 3. MULTI-TIER FIELD-PROGRAMMABLE GATE ARRAY HARDWARE REQUIREMENTS ASSESSMENT AND VERIFICATION FOR AIRBORNE ELECTRONIC SYSTEMS [P] . CA2851820A1 . 2015-01-12

  机译： 机载电子系统的多层现场可编程门阵列硬件要求评估和验证

• 4. MULTI-TIER FIELD-PROGRAMMABLE GATE ARRAY HARDWARE REQUIREMENTS ASSESSMENT AND VERIFICATION FOR AIRBORNE ELECTRONIC SYSTEMS [P] . 日本专利： JP2015018541A . 2015-01-29

  机译： 机载电子系统的多层现场可编程门阵列硬件要求评估和验证

• 5. Multi-tier field-programmable gate array hardware requirements assessment and verification for airborne electronic systems [P] . 美国专利： US8856708B1 . 2014-10-07

  机译： 机载电子系统的多层现场可编程门阵列硬件需求评估和验证

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• 1. Research on Intelligent Control System of Thermal Print Head Based on Field Programmable Gate Array [J] . Yang Xu ,Sheng Wang ,Ying Peng . 人工智能技术学报(英文) . 2021,第2期
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