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A vertical stack comprising a first level die, a second level die stacked back to back, and a third level die and having corresponding first, second, and third redistribution layers System in package and manufacturing method thereof
A vertical stack comprising a first level die, a second level die stacked back to back, and a third level die and having corresponding first, second, and third redistribution layers System in package and manufacturing method thereof
A vertically stacked system in package structure is described. A package includes a first level (125) molding (122) and fanout structure (130), a third level (185) molding (182) and fanout structure (190), It includes a second level (155) molding (152) and a fan-out structure (160) between the level (125) and the third level (185). The first level (125) molding (122) and fanout structure (130) includes a first level die (110), and the second level (155) molding (152) and fanout structure. The body (160) includes back-to-back dies (142), the front surface of each die (142) being bonded to the redistribution layer (130, 160), and forming the third level (185) (182). Includes a third level die (172). Multiple first level forming dies (110) can be used. The first level die (110) can be a volatile memory die, the second level die (142) can be a non-volatile memory die, and the third level die (172) is an active die. It can be. In the method of forming the vertical stack system-in-package, a carrier substrate can be used and later removed.
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