SHIED FOR A PHYSICAL VAPOR DEPOSITION CHAMBER SHIED FOR ENCIRCLING A SPUTTERING SURFACE OF A SPUTTERING TARGET AND PROCESS KIT

• 1. 被配置为用于在基板上进行溅射沉积的系统、用于溅射沉积腔室的屏蔽装置及用于在溅射沉积腔室中提供电屏蔽的方法 [P] . 中国专利： CN108291293A . 2018-07-17
• 2. 屏蔽层、屏蔽层的制造方法及氧化物溅射靶 [P] . 中国专利： CN111902561A . 2020-11-06
• 3. SHIED FOR A PHYSICAL VAPOR DEPOSITION CHAMBER SHIED FOR ENCIRCLING A SPUTTERING SURFACE OF A SPUTTERING TARGET AND PROCESS KIT [P] . 韩国专利： KR2004823270000Y1 . 2017-01-11

  机译： 屏蔽物理气相沉积室屏蔽溅射靶和过程套件的溅射表面

• 4. SHIED FOR A PHYSICAL VAPOR DEPOSITION CHAMBER SHIED FOR ENCIRCLING A SPUTTERING SURFACE OF A SPUTTERING TARGET AND PROCESS KIT [P] . 韩国专利： KR2020160003492U . 2016-10-10

  机译： 屏蔽物理气相沉积室屏蔽溅射靶和过程套件的溅射表面

• 5. Physical vapor deposition target member and sputtering target member, and physical vapor deposition film and manufacturing method of layer structure [P] . 韩国专利： KR20190085948A . 2019-07-19

  机译： 物理气相沉积靶构件和溅射靶构件，物理气相沉积膜和层结构的制造方法

• 1. Influence of Deposition Parameters on Surface Evolution of Sputtered Tantalum Thin Films [J] . LUO Xiang-dong, LUO Chong-tai 半导体光子学与技术（英文版） . 2008,第003期
• 2. Influence of process parameters on electrochemical and physical properties of sputtered iron-doped nickel oxide thin films [J] . HUANG Jin-zhao, XU Zheng, LI Hai-ling, 中国有色金属学报（英文版） . 2006,第006期
• 3. Influence of process parameters on electrochemical and physical properties of sputtered iron-doped nickel oxide thin films [J] . 黄金昭, 徐征, 李海玲, 中国有色金属学报：英文版 . 2006,第006期
• 4. Influence of Tungsten Sputtering Target Density on Physical Vapor Deposition Thin Film Properties [J] . CHI-FUNG LO, PETER MCDONALD, DARRYL DRAPER, Journal of Electronic Materials . 2005,第12期
• 5. Low target power wafer sputtering regime identified during magnetron tantalum barrier physical vapor deposition [J] . Phillip J. Stout, Dean J. Denning, Lynne M. Michaelson, Journal of Applied Physics . 2005,第2期
• 6. Chemical and physical sputtering effects on the surface morphology of carbon films grown by plasma chemical vapor deposition [J] . Luis Vazquez, Josephus G. Buijnsters Journal of Applied Physics . 2009,第3期
• 7. Deposition and characterization of ZnO, ZnO:Al thin films deposited by rf-sputtering for Cu(In,Ga)Se2 thin film solar cells processing by physical vapor deposition [C] . J.Sastré-Hernández, F.A.Zubieta-López, M.Tufi(n)o-Velázquez, The 22nd International photovoltaic science and engineering conference . 2012
• 8. Application of diamond films to electric propulsion: Low energy sputter yield measurement and MPD plasma assisted chemical vapor deposition. [D] . Blandino, John Joseph. 2001
• 9. Novel Physical Vapor Deposition Approach to Hybrid Perovskites: Growth of MAPbI3 Thin Films by RF-Magnetron Sputtering [O] . Sara Bonomi, Daniela Marongiu, Nicola Sestu, -1
• 10. Chemical and physical sputtering effects on the surface morphology of carbon films grown by plasma chemical vapor deposition [O] . Vazquez L., Buijnsters J.G. 2009
• 11. Studies on ion scattering and sputtering processes in ion beam sputter-deposition of high (Tc) superconducting films: The optimization of deposition parameters. [R] . Ameen, M. S., Kingon, A. I., Auciello, O., 1989

• 1. Correlation between Chemical Glass Components and the Glass Sticking on Sputtered PtIr Physical Vapour Deposition Coatings for Precision Blank Moulding [J] . Kirsten Bobzin ,Nazlim Bagcivan ,Tobias Brogelmann . 材料科学与应用期刊（英文） . 2014,第5期
• 2. Effect of Cold Deformation and Annealing on Microstructure of Al-Ti Alloy Target for Sputter Deposition [J] . 吴丽君 ,夏慧 ,袁冠森 . 稀有金属：英文版 . 2000,第3期
• 3. 混响室环境下小屏蔽体屏蔽效能测量重复性研究 [C] . 程二威 ,王庆国 ,杨权 . 中国物理学会第十五届静电学术会议 . 2009
• 4. 基于屏蔽室法的材料电磁屏蔽效能的简易测试方法及影响因素分析 [A] . 史晓宁 . 2015