首页> 外国专利> ADHESIVE FILM ADHESIVE FILM INTEGRATED WITH DICING SHEET ADHESIVE FILM INTEGRATED WITH BACK GRIND TAPE ADHESIVE FILM INTEGRATED WITH BACK GRIND TAPE CUM DICING SHEET LAMINATE CURED PRODUCT OF LAMINATE SEMICONDUCTOR DEVICE AND PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE

ADHESIVE FILM ADHESIVE FILM INTEGRATED WITH DICING SHEET ADHESIVE FILM INTEGRATED WITH BACK GRIND TAPE ADHESIVE FILM INTEGRATED WITH BACK GRIND TAPE CUM DICING SHEET LAMINATE CURED PRODUCT OF LAMINATE SEMICONDUCTOR DEVICE AND PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE

机译：粘合片与切成薄片的胶粘片粘合片与后磨带的胶粘片粘合片与背磨的带胶的丁片切成薄片层压的层状半导体器件的固化产品和生产工艺

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摘要

An object of the present invention is to provide an adhesive film (10) that can provide sufficient transparency and reliability of solder joints. The present invention provides an electronic component (20) having an electronic component (20) having a plurality of first terminals (21) on its surface and a circuit component (30) having a plurality of second terminals Wherein the width of the first terminal (21) is 3 or more and 100 or less, and the first terminal (21) (A / B), where A is the width of the first terminal (21), and B is the width of the metal composition, wherein the first terminal (21) has a low melting point metal composition covering at least a part of the terminal surface, B is not less than 2 and not more than 170 ; a distance between the metal compositions of adjacent first terminals (21) is not less than 3 and not more than 60 ; the adhesive film (10) 10 to 70% by weight, and has a surface roughness Ra of 0.03 to 1.0 m A.;

机译：本发明的目的是提供一种可以提供足够的透明性和焊点可靠性的粘合膜（10）。本发明提供一种电子部件（20），其具有在其表面上具有多个第一端子（21）的电子部件（20）和具有多个第二端子的电路部件（30），其中，第一端子的宽度（ 21）为3以上且100以下，并且第一端子（21）为（A / B），其中A为第一端子（21）的宽度，而B为金属成分的宽度，其中第一端子（21）具有覆盖端子表面的至少一部分的低熔点金属组成，B为2以上且170以下。相邻的第一端子（21）的金属成分之间的距离为3以上且60以下。粘合膜（10）为10〜70重量％，表面粗糙度Ra为0.03〜1.0mA。

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公开/公告号KR101735983B1

专利类型
公开/公告日2017-05-15

原文格式PDF
申请/专利权人 스미또모 베이크라이트 가부시키가이샤;
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申请/专利号KR20157022886
发明设计人 마에지마 겐조;
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申请日2014-03-05
分类号C09J7/00;C09J11/04;C09J163/00;H01L21/56;H01L21/683;H01L23/00;H01L23/29;
国家 KR
入库时间 2022-08-21 13:25:31

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