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2D 3D IC INTEGRATED INTERPOSER SOLUTIONS FOR 2D AND 3D IC PACKAGING
2D 3D IC INTEGRATED INTERPOSER SOLUTIONS FOR 2D AND 3D IC PACKAGING
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机译：用于2D和3D IC包装的2D 3D IC集成中介层解决方案
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摘要
An integrated circuit (IC) package includes a first substrate having a back surface and an upper surface over which the cavity is disposed. The cavity has a bottom defining a front surface. A plurality of first electrically conductive contacts are disposed on the front surface and a plurality of second electrically conductive contacts are disposed on the back surface. A plurality of first electrically conductive elements penetrate the first substrate and couple the selected ones of the first and second electrically conductive contacts to each other. A first die comprising the IC is electrically conductively coupled to a corresponding one of the first electrically conductive contacts. The second substrate has a bottom surface that is sealingly attached to the top surface of the first substrate, and the dielectric material is disposed within the cavity to seal the first die.
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