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Heat sink structure with a vapor-permeable membrane for two-phase cooling

机译：带有透汽膜的散热器结构，用于两相冷却

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摘要

A heat sink, and cooled electronic structure and cooled electronics apparatus utilizing the heat sink are provided. The heat sink is fabricated of a thermally conductive structure which includes one or more coolant-carrying channels coupled to facilitate the flow of coolant through the coolant-carrying channel(s). The heat sink further includes a membrane associated with the coolant-carrying channel(s). The membrane includes at least one vapor-permeable region, which overlies a portion of the coolant-carrying channel(s) and facilitates removal of vapor from the coolant-carrying channel(s), and at least one orifice coupled to inject coolant onto at least one surface of the coolant-carrying channel(s) intermediate opposite ends of the channel(s).

机译：提供了一种散热器，以及利用该散热器的冷却的电子结构和冷却的电子设备。散热器由导热结构制成，该导热结构包括一个或多个冷却剂携带通道，该通道被耦合以促进冷却剂流过冷却剂携带通道。散热器进一步包括与冷却剂承载通道相关联的膜。该膜片包括至少一个蒸汽可渗透区域，该至少一个蒸汽可渗透区域覆盖在一个或多个冷却剂运载通道的一部分上，并且有助于从一个或多个冷却剂运载通道中去除蒸汽，以及至少一个孔口，其被耦合以将冷却剂注入到至少一个孔上。所述冷却剂承载通道的至少一个表面在所述通道的相对端之间。

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公开/公告号US9687943B2

专利类型
公开/公告日2017-06-27

原文格式PDF
申请/专利权人 INTERNATIONAL BUSINESS MACHINES CORPORATION;
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申请/专利号US201615183104
发明设计人 MADHUSUDAN K. IYENGAR;ROBERT E. SIMONS;LEVI A. CAMPBELL;RICHARD C. CHU;MICHAEL J. ELLSWORTH JR.;MILNES P. DAVID;
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申请日2016-06-15
分类号B23P15/26;H05K7/20;G06F1/20;F28F3/00;F28F3/12;F28F13/00;F28D15/02;
国家 US
入库时间 2022-08-21 13:44:11

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