首页> 外国专利> Mask blank substrate manufacturing method, multilayer reflective film coated substrate manufacturing method, reflective mask blank manufacturing method, reflective mask manufacturing method, transmissive mask blank manufacturing method, transmissive mask manufacturing method, and semiconductor device Manufacturing method

Mask blank substrate manufacturing method, multilayer reflective film coated substrate manufacturing method, reflective mask blank manufacturing method, reflective mask manufacturing method, transmissive mask blank manufacturing method, transmissive mask manufacturing method, and semiconductor device Manufacturing method

机译：掩模坯料基板的制造方法，多层反射膜涂覆基板的制造方法，反射型掩模坯料的制造方法，反射型掩模制造法，透射型掩模坯料的制造方法，透射型掩模制造法，以及半导体装置的制造方法

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摘要

Disclosed is a mask blank substrate for use in lithography, wherein the main surface on which the transfer pattern of the substrate is formed has a root mean square roughness (Rms) of not more than 0.15 nm obtained by measuring an area of 1 μm×1 μm with an atomic force microscope, and has a power spectrum density of not more than 10 nm4 at a spatial frequency of not less than 1 μm−1.

机译：公开了一种用于光刻的掩模坯料基板，其中形成有基板的转印图案的主表面具有通过测量1μm×1的面积获得的不大于0.15nm的均方根粗糙度（Rms）。用原子力显微镜测得的μm，并且在不小于1μm-1的空间频率下具有不大于10 nm4的功率谱密度。

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公开/公告号JP6195880B2

专利类型
公开/公告日2017-09-13

原文格式PDF
申请/专利权人ＨＯＹＡ株式会社;
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申请/专利号JP20150202956
发明设计人折原敏彦;浜本和宏;小坂井弘文;臼井洋一;笑喜勉;堀川順一;
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申请日2015-10-14
分类号G03F1/60;G03F1/84;G03F1/24;C03C15/02;C03C17/34;
国家 JP
入库时间 2022-08-21 13:57:39

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