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Structure and method of implementing embedded serial data test loopback that resides directly under the device under test in a printed circuit board
Structure and method of implementing embedded serial data test loopback that resides directly under the device under test in a printed circuit board
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机译：实现嵌入式串行数据测试环回的结构和方法，该环回直接位于被测设备的印刷电路板中
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摘要
In response to specific demands, methods and structures are provided with multiple embodiments of placing (embedding) a known design serial loopback circuit on a printed circuit board directly under the device under test. Microvias and traces connecting components including a transmit component (Tx) and a receive component (Rx) are formed in a loopback circuit for connection to a device under test (DUT). This connection is achieved by the coupling capacitor with the shortest possible electrical length close to the straight line between the component and the DUT, the distance being the product of the short straight line and the square root of 2 The component is located below the DUT.
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