BODY-IMPLANTABLE SENSED-DATA PROCESSING PACKAGE, SENSED-DATA PROCESSOR, AND SENSED-DATA PROCESSING SYSTEM

• 1. 带采样功能的传感器设备以及使用了该传感器设备的传感器数据处理系统 [P] . 中国专利： CN103733030B . 2016.01.20
• 2. 带采样功能的传感器设备以及使用了该传感器设备的传感器数据处理系统 [P] . 中国专利： CN103733030A . 2014-04-16
• 3. Package for processing sensed-data, sensed-data processor, and system for processing sensed-data [P] . 美国专利： US10105102B2 . 2018-10-23

  机译： 用于处理感测数据的封装，感测数据处理器以及用于处理感测数据的系统

• 4. PACKAGE FOR PROCESSING SENSED-DATA, SENSED-DATA PROCESSOR, AND SYSTEM FOR PROCESSING SENSED-DATA [P] . 美国专利： US2016051197A1 . 2016-02-25

  机译： 用于处理感测数据的程序包，用于处理感测数据的处理器以及用于处理感测数据的系统

• 5. Body-implanted Sensed-data Processing Device Package therein and System therewith [P] . KR102295529B1 . 2021-08-31

  机译： 身体植入的传感数据处理设备封装和系统中的系统

• 1. Real-time Parallel Processing System Design and Implementation for Underwater Acoustic Communication Based on Multiple Processors [J] . YAN Zhen-hua, HUANG Jian-guo, ZHANG Qun-fei, 兵工学报（英文版） . 2007,第002期
• 2. Life cycle inventory for base metal ingots production in Japan including mining and mineral processing processes by cost estimating system database [J] . T. ADACHI, G. MOGI 中国有色金属学会会刊：英文版 . 2007,第A01期
• 3. Femtosecond laser additive and subtractive micro-processing:enabling a high-channeldensity silica interposer for multicore fibre to silicon-photonic packaging [J] . Gligor Djogo, Jianzhao Li, Stephen Ho, 极端制造（英文） . 2019,第004期
• 4. Total Processing & Packaging 2010 Provlow: TOTAL PROCESSING & PACKAGING WILL DELIVER THE COMPLETE SOLUTION [J] . Bulk Solids Today Group Bulk Solids Today . 2010,第77期
• 5. The Complete Processing & Packaging Event Total Processing & Packaging 2010 (Total 2010)欧州包装専門視察団 [J] . 包装技術 . 2010,第3期
• 6. Planning of executing package of jobs in distributed-processing system with protected data to control technological processes [J] . A. Yu. Bykov Вестник Московского государственного технического университета. Серия приборостроение . 2001,第2期
• 7. 8.1 Lakefield and Mobility Compute: A 3D Stacked 10nm and 22FFL Hybrid Processor System in 12×12mm², 1mm Package-on-Package [C] . Wilfred Gomes, Sanjeev Khushu, Doug B. Ingerly, IEEE International Solid- State Circuits Conference . 2020
• 8. Development of high reliability and high processability thermosets for electronic packaging applications based on ternary systems of benzoxazine, epoxy and phenolic resins. [D] . Rimdusit, Sarawut. 2000
• 9. Graphics Processing Unit (GPU) implementation of image processing algorithms to improve system performance of the Control Acquisition Processing and Image Display System (CAPIDS) of the Micro-Angiographic Fluoroscope (MAF) [O] . S.N. Swetadri Vasan, Ciprian N. Ionita, A.H. Titus, -1
• 10. Estabilidade de repolho minimamente processado sob diferentes sistemas de embalagem Storage of minimally processed cabbage in differents packaging systems [O] . Maria Madalena Rinaldi, Benedito Carlos Benedetti, Claire Isabel Grígoli de Luca Sarantópoulos, 2009
• 11. Medicaid Bill, Processing Systems Test. Volume 2. BPST Test Package [R] . 1981

• 1. Quality of Melon 'UFERSA-05 var.ACIDULUS and Pele de Sapo“Mabel”Minimally Processed,Kept in Different Packages [J] . Maria Luiza Pereira de Araújo ,Fanquiele Ribeiro de Oliveira ,Marianne Lima Barboza . 食品与营养科学（英文） . 2014,第8期
• 2. Measuring the antioxidative activities of Queso Fresco after post-packaging high-pressure processing [J] . Moushumi Paul ,Jeffrey D. Brewster ,Diane L. Van Hekken . 生命科学与技术进展（英文） . 2012,第4期
• 3. 联合收获机多传感器信号采集与数据处理系统 [C] . 郑世宇 ,陈进 ,李耀明 . 2011收获机械技术及装备国际高层论坛 . 2011
• 4. AER图像传感器图像数据处理系统设计 [A] . 雷靖 . 2017