首页> 外国专利> LASER NANOSTRUCTURING AND MICROSTRUCTURING OF SILICON USING A LASER-INDUCED PLASMA FOR THE PROCESSING OF THE PROCESSING LASER BEAM

LASER NANOSTRUCTURING AND MICROSTRUCTURING OF SILICON USING A LASER-INDUCED PLASMA FOR THE PROCESSING OF THE PROCESSING LASER BEAM

机译:激光诱导等离子体对硅的纳米结构和硅微结构的加工

摘要

Laser nanostructuring and microstructuring of silicon using a laser-induced plasma for the processing of the processing laser beam. The method according to the invention is characterised in that it comprises a step of ablation wherein a first, ablation pulsed laser beam is directed, with a fluence in the range of 10 - 100 J·cm-2, onto the surface of a metal sample generating a laser-induced plasma, and a processing step wherein a second, processing pulsed laser beam, is directed, with a fluence of 0,3 Jcm-2, delayed by between 0.1 and 1 microseconds in relation to the ablation laser beam, onto a silicon surface close to the laser-induced plaza such that said second laser beam passes through said plasma perpendicularly to the plasma expansion axis.
机译:使用激光诱导的等离子体对硅进行激光纳米结构化和微结构化,以处理加工激光束。根据本发明的方法的特征在于,其包括烧蚀步骤,其中引导第一烧蚀脉冲激光束,其注量在10-100J·cm - 2的范围内,到产生激光诱导等离子体的金属样品表面上,然后进行处理,在该处理步骤中,处理通量为0.3 Jcm -2 的第二个处理脉冲激光束被延迟相对于消融激光束在0.1至1微秒之间的时间间隔内,在接近于激光诱导的广场的硅表面上,使得所述第二激光束垂直于等离子体膨胀轴穿过所述等离子体。

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