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DOUBLE-ACTING SYNTHETIC JET MODULE FOR COOLING OF ELECTRONIC DEVICES

机译:用于电子设备冷却的双反应合成射流模块

摘要

The invention describes an active fluid cooling device for cooling of electronic devices, which comprises a housing in which a cavity is incorporated, wherein the cavity of the housing is divided by a first piezoelectric actuator and a second piezoelectric actuator which each have a planar form into three chambers, wherein the first piezoelectric actuator defines together with the housing an upper air chamber, wherein the first piezoelectric actuator together with the second piezoelectric actuator and the housing defines a middle air chamber, and wherein second piezoelectric actuator together with the housing defines a bottom air chamber, wherein the upper air chamber is in cooperation with an upper opening of the housing and wherein the middle air chamber is in cooperation with a middle opening of the housing and wherein the bottom air chamber is in cooperation with a lower opening of the housing, wherein a positive electric potential and a negative electric potential are applied in alternating way to the two piezoelectric actuators in such a way that the volumes of the upper air chamber, middle air chamber and bottom air chamber within the cavity of the housing are changing to result in a fluid stream in and out of the openings of the housing, so that the generated fluid stream is usable for cooling a heat generating element of an electronic device.
机译:本发明描述了一种用于冷却电子设备的有源流体冷却装置,该有源流体冷却装置包括其中装有腔的壳体,其中壳体的腔被第一压电致动器和第二压电致动器分开,第一压电致动器和第二压电致动器分别具有平面形式。三个腔室,其中第一压电致动器与壳体一起限定了上部空气室,其中第一压电致动器与第二压电致动器和壳体一起限定了中间气室,并且其中第二压电致动器与壳体一起限定了底部。空气室,其中上部空气室与壳体的上部开口配合,并且其中中间空气室与壳体的中间开口配合,并且其中底部空气室与壳体的下部开口配合,其中正电势和负电势施加在与两个压电致动器的交替方式,使得壳体腔内的上气室,中气室和下气室的容积发生变化,从而导致流体流进出壳体的开口因此,所产生的流体流可用于冷却电子设备的发热元件。

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