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Integrated circuit assembly for high-frequency on-board printed circuit board testing,validation, and verification

机译:用于高频板上印刷电路板测试,验证和验证的集成电路组件

摘要

An integrated circuit assembly includes a main board unit mounted fixedly on and connected electrically to an external circuit board, a daughter board unit disposed on and connected detachably to the main board unit, and an integrated circuit device mounted fixedly on and connected electrically to the daughter board unit. When the daughter board unit is connected to the main board unit, the integrated circuit device is connected electrically to the external circuit board via the main board unit and the daughter board unit.
机译:集成电路组件包括:固定地安装在外部电路板上并与其电连接的主板单元;布置在并可以拆卸地连接至该主板单元上的子板单元;以及固定地安装并与其电连接的集成电路装置。板单元。当子板单元连接到主板单元时,集成电路装置经由主板单元和子板单元电连接到外部电路板。

著录项

  • 公开/公告号US9054466B2

    专利类型

  • 公开/公告日2015-06-09

    原文格式PDF

  • 申请/专利权人 DAVID S. LIN;

    申请/专利号US201213586981

  • 发明设计人 DAVID S. LIN;

    申请日2012-08-16

  • 分类号H05K7/00;H01R12/71;H01R12/73;H05K1/14;H05K3/32;H05K3/34;

  • 国家 US

  • 入库时间 2022-08-21 15:17:15

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