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INLINE INSPECTION OF THE CONTACT BETWEEN CONDUCTIVE TRACES AND SUBSTRATE FOR HIDDEN DEFECTS USING WHITE LIGHT INTERFEROMETER WITH TILTED OBJECTIVE LENS
INLINE INSPECTION OF THE CONTACT BETWEEN CONDUCTIVE TRACES AND SUBSTRATE FOR HIDDEN DEFECTS USING WHITE LIGHT INTERFEROMETER WITH TILTED OBJECTIVE LENS
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机译：使用带有倾斜目标透镜的白光干涉仪在线检查导电痕迹和基材之间的接触是否存在隐患
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摘要
Embodiments include devices, systems and processes for using a white light interferometer (WLI) microscope with a tilted objective lens to perform in-line monitoring of both resist footing defects and conductive trace undercut defects. The defects may be detected at the interface between dry film resist (DFR) footings and conductive trace footing formed on insulating layer top surfaces of a packaging substrate. Such footing and undercut defects may other wise be considered “hidden defects”. Using the WLI microscope with a tilted objective lens provides a high-throughput and low cost metrology and tool for non-destructive, non-contact, in-line monitoring.
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