Apparatus having thermal-enhanced and cost-effective 3D IC integration structure with through silicon via interposers

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  机译： 具有热增强且具有成本效益的3D IC集成结构的设备，该结构具有通过中介层的直通硅

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  机译： 半导体中介层及其制造方法（用于3D芯片堆叠的硅中介层的测试）

• 5. EMBEDDED 3D INTERPOSER STRUCTURE WITH THE INTERPOSER INCLUDING ONE OR MORE DIELECTRIC LAYERS [P] . 韩国专利： KR20120000483A . 2012-01-02

  机译： 包含一个或多个介电层的插入器的嵌入式3D插入器结构

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