METHOD OF REMOVING RESIDUE DURING SEMICONDUCTOR DEVICE FABRICATION

• 1. 在制造半导体器件过程中去除残留物的方法 [P] . 中国专利： CN103390540A . 2013-11-13
• 2. 用于在半导体器件制造过程中选择性去除氮化硅的蚀刻溶液和方法 [P] . 中国专利： CN113557287A . 2021-10-26
• 3. Method for removing molding residues in the fabrication of plastic packages for semiconductor devices [P] . 美国专利： US6468356B1 . 2002-10-22

  机译： 在制造用于半导体器件的塑料封装中去除模制残留物的方法

• 4. METHOD FOR REMOVING MOLDING RESIDUES IN THE FABRICATION OF PLASTIC PACKAGES FOR SEMICONDUCTOR DEVICES [P] . 美国专利： US2001008139A1 . 2001-07-19

  机译： 去除半导体装置塑料包装中模制残留物的方法

• 5. Method for removing moulding residues in the fabrication of plastic packages for semiconductor devices [P] . 欧洲知识产权局专利： EP0905762A1 . 1999-03-31

  机译： 在制造用于半导体器件的塑料封装中去除模制残留物的方法

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