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THERMOSETTING RESIN COMPOSITION, RESIN FILM IN B-STAGE, METAL FOIL, COPPER-CLAD PLATE, AND MULTILAYER BUILDUP SUBSTRATE

机译：热固性树脂成分，B级树脂膜，金属箔，覆铜板和多层构建基体

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摘要

PROBLEM TO BE SOLVED: To provide an epoxy-based thermosetting resin which shows flexibility, can be formed into a thin insulating layer, has reliability and processing characteristics comparable to a halogen-free FR-4, and causes little resin flow during vacuum pressing.;SOLUTION: The thermosetting resin composition comprises (a1) a liquid epoxy resin, (a2) a solid epoxy resin, (b) an aromatic diamine compound having an ether group, (c) a solvent-soluble polyimide resin having a weight average molecular weight Mw of 50000 or less, and (d) a phenoxy resin. When the total amount of the (a1) liquid epoxy resin, the (a2) solid epoxy resin and the (b) diamine compound is set to 100 parts by weight, the total amount of the (c) solvent-soluble polyimide resin and the (d) phenoxy resin is 15 parts by weight or more and 100 parts by weight or less.;COPYRIGHT: (C)2014,JPO&INPIT

机译：解决的问题：提供一种基于环氧树脂的热固性树脂，其显示出柔韧性，可以形成薄的绝缘层，具有与无卤素FR-4相当的可靠性和加工特性，并且在真空压制过程中几乎不引起树脂流动。 ;解决方案：热固性树脂组合物包含（a1）液态环氧树脂，（a2）固态环氧树脂，（b）具有醚基的芳族二胺化合物，（c）具有重均分子量的溶剂可溶性聚酰亚胺树脂Mw为50000以下，以及（d）苯氧基树脂。当（a1）液态环氧树脂，（a2）固态环氧树脂和（b）二胺化合物的总量为100重量份时，（c）溶剂可溶性聚酰亚胺树脂和（d）苯氧基树脂含量为15重量份以上且100重量份以下。;版权：（C）2014，JPO＆INPIT

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公开/公告号JP2014058592A

专利类型
公开/公告日2014-04-03

原文格式PDF
申请/专利权人 TAMURA SEISAKUSHO CO LTD;
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申请/专利号JP20120202804
发明设计人 ISHIZAKA MASANOBU;KAKIUCHI NAOYA;TANAHASHI YUSUKE;
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申请日2012-09-14
分类号C08G59/50;C08K3/38;C08K3/28;C08K3/36;C08K3/22;C08L63/00;C08L79/08;C08L71/10;C08J5/24;B32B15/08;B32B15/088;B32B15/092;
国家 JP
入库时间 2022-08-21 16:18:11

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