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A method for inspection of the state of the wetting with solder, an apparatus for the automatic optical inspection, which this method is used, as well as conductor plates inspection system
A method for inspection of the state of the wetting with solder, an apparatus for the automatic optical inspection, which this method is used, as well as conductor plates inspection system
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机译：检查焊料润湿状态的方法，使用该方法的自动光学检查设备以及导体板检查系统
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摘要
Problem: decisions about the state of the wetting with solder at locations provided with solder, to make the locations at which the optical measurement is difficult.Means for releasing of the problem: a post - reflow - an inspection apparatus 30 can be inspected printed circuit boards, which is a components equipping process and have passed through a reflow - process after according to any one of slag pressure process the amount of solder paste, the to the individual soldering surfaces has been applied was measured. With the inspection apparatus 30, in the case of illumination with a lit illumination device 305 recording an image by a camera 302 is carried out which, on the front side of the printed circuit board to be inspected is directed, and it is provided with solder at a point which has a feature which is not in a generated image appears and on which the solder paste, which was measured at the corresponding soldering surface, a predetermined minimum condition is fulfilled, a feature is measured, which appears in the image, and which has the form of at a site of the provided with solder point, the not appears in the image is related. The quality of the wetting with solder at the provided with solder location is based on the result of the measurement is evaluated.
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