首页> 外国专利> Wire bonding system useful for forming wire loop, comprises bonding head, bonding tool, wire supply formed for bonding using bonding tool, and wire shaping tool, which is independently movable with respect to bonding head and bonding tool

Wire bonding system useful for forming wire loop, comprises bonding head, bonding tool, wire supply formed for bonding using bonding tool, and wire shaping tool, which is independently movable with respect to bonding head and bonding tool

机译:可用于形成线环的线键合系统,包括键合头,键合工具,为使用键合工具进行键合而形成的导线供应器和线成形工具,后者可相对于键合头和键合工具独立移动

摘要

Wire bonding system (300) comprises a bonding head, a bonding tool (302) carried by the bonding head, a wire supply, which is formed for bonding using the bonding tool, and a wire shaping tool, which is carried by the bonding head, and is independently movable with respect to the bonding head and the bonding tool. An independent claim is also included for forming a wire loop, comprising (a) bonding a first region of a wire from a wire supply, to a first bonding site of a substrate using a wire bonding tool, which is carried by the bonding head, (b) conducting the wire from the first bonding site to an elevated position above the first bonding site, (c) forming a second region of the wire in the vicinity of the elevated position, for forming a bend using the wire shaping tool, which is carried by the bonding head, and is movable with respect to the bonding head and the wire bonding tool, (d) conducting the wire to a second bonding site of the substrate, and (e) bonding a third region of the wire to the second bonding site using the wire bonding tool.
机译:引线键合系统(300)包括键合头,由键合头承载的键合工具(302),形成为使用键合工具进行键合的导线供应装置以及由键合头承载的导线整形工具,并且可以相对于键合头和键合工具独立移动。还包括用于形成线环的独立权利要求,其包括:(a)使用由键合头承载的线键合工具,将来自线源的线的第一区域键合至基板的第一键合部位, (b)将导线从第一键合部位传导到第一键合部位上方的升高位置,(c)在升高位置附近形成导线的第二区域,以使用导线成形工具形成弯曲,引线由键合头承载,并且可相对于键合头和线键合工具移动,(d)将线导至基板的第二键合位置,以及(e)将线的第三区域键合至基板使用引线键合工具的第二个键合部位。

著录项

  • 公开/公告号DE102013201868A1

    专利类型

  • 公开/公告日2013-08-08

    原文格式PDF

  • 申请/专利权人 ORTHODYNE ELECTRONICS CORPORATION;

    申请/专利号DE201310201868

  • 发明设计人 BYARS JONATHAN MICHAEL;

    申请日2013-02-05

  • 分类号H01L21/607;H01L23/49;B23K20/10;

  • 国家 DE

  • 入库时间 2022-08-21 16:21:38

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