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Physical vapor deposition process for spray coating mechanical component, which is placed in chamber, with tantalum target, by injecting mixture of argon and carbon/argon and nitrogen into chamber to obtain e.g. tantalum carbide coating
Physical vapor deposition process for spray coating mechanical component, which is placed in chamber, with tantalum target, by injecting mixture of argon and carbon/argon and nitrogen into chamber to obtain e.g. tantalum carbide coating
The process comprises injecting a mixture of argon and carbon or a mixture of argon and nitrogen into a vacuum chamber (2) to obtain a tantalum carbide coating or tantalum nitride coating, injecting a mixture of argon, nitrogen and carbon into the chamber to obtain tantalum carbon nitride coating, and injecting a mixture of argon and nitrogen into the chamber to obtain tantalum carbon nitride coating. The physical vapor deposition process is performed at a temperature of 40-80[deg] C, an alternating voltage of 100-200 V and a frequency of 13.56 MHZ. The chamber has a pressure of 10 - 3mbar. An independent claim is included for a mechanical component.
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