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PLATING METHOD OF A PRINTED CIRCUIT BOARD INCLUDING AN ELECTROLYTIC NICKEL-TUNGSTEN PLATING LAYER AND A GOLD PLATING LAYER WITH HIGH HARDNESS, ABRASION RESISTANCE, AND CORROSION RESISTANCE
PLATING METHOD OF A PRINTED CIRCUIT BOARD INCLUDING AN ELECTROLYTIC NICKEL-TUNGSTEN PLATING LAYER AND A GOLD PLATING LAYER WITH HIGH HARDNESS, ABRASION RESISTANCE, AND CORROSION RESISTANCE
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机译：印刷电路板的电镀方法，包括高硬度，耐磨性和耐蚀性的电解镍-钨电镀层和金电镀层
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PURPOSE: A plating method of a printed circuit board is provided to decrease the thickness of a hardened gold plating layer up to less than a half of the thickness, thereby providing process time reduction, productivity improvement, and remarkable cost reduction.;CONSTITUTION: A plating method of a printed circuit board comprises the following steps. A printed circuit board is dipped in the electrodeposition bath in which nickel-tungsten alloy plating solution, which includes a water-soluble nickel chemical compound, a water-soluble tungsten compound, complex agent, and ductility improving agent, is filled(S1). The current is applied between both electrodes in the electrodeposition bath, and the nickel-tungsten alloy plating layer is formed on the surface of printed circuit board(S2). The gold plating layer is formed on the nickel-tungsten alloy plating layer(S3). The gold plating layer is a hardened gold plating layer or a gold-copper alloy plating layer. The plating method of printed circuit board uses the direct current to apply the current.;COPYRIGHT KIPO 2013;[Reference numerals] (AA) Start; (BB) End; (S1) Dip a printed circuit board in an electrodeposition bath filled with nickel-tungsten alloy plating solution, which includes a water-soluble nickel compound, a water-soluble tungsten compound, a complex agent, and a ductility improving agent; (S2) Apply current to form a nickel-tungsten alloy plating layer on the surface of the printed circuit board; (S3) Form a gold plating layer on the nickel-tungsten alloy plating layer
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