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EDDY CURRENT SENSOR, A GRINDING METHOD, AND A GRINDING DEVICE CAPABLE OF REDUCING TIME FOR PROCESSING BY ADDITIONALLY GRINDING WHEN RESIDUES OF A FILM IS DETECTED
EDDY CURRENT SENSOR, A GRINDING METHOD, AND A GRINDING DEVICE CAPABLE OF REDUCING TIME FOR PROCESSING BY ADDITIONALLY GRINDING WHEN RESIDUES OF A FILM IS DETECTED
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机译：涡流传感器，一种研磨方法和一种研磨装置，能够减少检测膜残渣时进行额外研磨的时间
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摘要
PURPOSE: An eddy current sensor, a grinding method, and a grinding device are provided to inspect the existence of residues of metal film or a conductive film on a substrate in a grinding process by using the eddy current sensor, thereby reducing time for inspection.;CONSTITUTION: An eddy current sensor is arranged near a wafer in which a metal film or a conductive film is formed and detects eddy currents formed on the metal film or the conductive film. A conducting wire or a plurality of coils (63A, 63B), which have different size and are coiled around a conductor, are separately arranged so that the outer coil covers the inner coil. Each of the coils separately detects the eddy current formed on the metal film or the conductive film.;COPYRIGHT KIPO 2013;[Reference numerals] (10T) Fifth row second floor; (AA,CC) Floor; (BB,DD) Row
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