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METHOD FOR PRODUCING AN INTEGRATED MICROFLUIDIC SYSTEM AND INTEGRATED MICROFLUIDIC SYSTEM

机译:集成微流体系统的生产方法和集成微流体系统

摘要

The invention relates to the production of an integrated microfluidic system and to the integrated microfluidic system as such. An electronics substrate, especially a semiconductor chip, is connected to a microfluidic substrate in a flip-chip configuration. For this purpose, the fluidic connecting elements of the two substrates to be interconnected are interconnected by a first adhesive and the electrical contacts of the two substrates are interconnected by a second adhesive. The adhesives are cured, the second adhesive curing first.
机译:本发明涉及集成微流体系统的生产,并且涉及这样的集成微流体系统。电子衬底,特别是半导体芯片,以倒装芯片配置连接到微流体衬底。为此目的,待互连的两个基板的流体连接元件通过第一粘合剂互连,并且两个基板的电触点通过第二粘合剂互连。粘合剂被固化,第二粘合剂首先被固化。

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