首页> 外国专利> METHOD FOR PRODUCING CURED RESIST USING NEGATIVE PHOTOSENSITIVE RESIN LAMINATE, NEGATIVE PHOTOSENSITIVE RESIN LAMINATE, AND USE OF NEGATIVE PHOTOSENSITIVE RESIN LAMINATE

METHOD FOR PRODUCING CURED RESIST USING NEGATIVE PHOTOSENSITIVE RESIN LAMINATE, NEGATIVE PHOTOSENSITIVE RESIN LAMINATE, AND USE OF NEGATIVE PHOTOSENSITIVE RESIN LAMINATE

机译:负性光敏树脂层压板,负性光敏树脂层压板和使用负性光敏树脂层压板生产固化电阻的方法

摘要

Provides adhesion, and the resolution to obtain an excellent resist pattern and excellent resist shape, resist cured production method, use of the negative-type photosensitive resin laminate, and a negative-type photosensitive resin laminate after the development. Water production method resist hardening according to the present invention, at least the support (A) and the negative-type photosensitive resin layer (B) and the substrate laminate (C) forming a negative photosensitive resin laminate comprising a stacked body forming step, a picture an exposure step for exposing the negative type photosensitive resin layer (B) through the lens using a light that projects an image of a mask and by removing developing the unexposed portion of the negative photosensitive resin layer (B), the negative photosensitive resin curing comprises a developing step of forming a resist cured, and formed of parts of the negative-type photosensitive resin layer (B) light transmittance is 25% or more ways than the resist cured 50% of the water produced at a wavelength of 365 ㎚ of the (B) to be. ;
机译:提供附着力和分辨率,以获得优异的抗蚀剂图案和优异的抗蚀剂形状,抗蚀剂固化的生产方法,使用负型感光性树脂层压板和显影后的负型感光性树脂层压板。根据本发明的水生产方法的抗蚀剂硬化,至少包括形成堆叠体形成步骤的支撑体(A)和负型光敏树脂层(B)以及形成负型光敏树脂层压体的基底层压体(C),图中的曝光步骤是,使用投射掩膜图像的光通过透镜使负型感光性树脂层(B)曝光,并通过去除负型感光性树脂层(B)的未曝光部分的显影,使负型感光性树脂固化包括形成抗蚀剂固化的显影步骤,并且由负型光敏树脂层(B)的一部分形成,在365 than波长下产生的水的透光率是抗蚀剂固化的50%的25%或更多。 (B)是。 ;

著录项

  • 公开/公告号KR101175079B1

    专利类型

  • 公开/公告日2012-08-21

    原文格式PDF

  • 申请/专利权人

    申请/专利号KR20107004845

  • 发明设计人 이데 요우이치로;

    申请日2008-12-15

  • 分类号H05K3/06;H05K3/18;G03F7/004;G03F7/42;

  • 国家 KR

  • 入库时间 2022-08-21 17:07:35

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