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METHOD FOR FABRICATING ULTRA-HIGH RELIABLE MICRO-ELECTRONIC PACKAGE AND MICRO-ELECTRONIC PACKAGE FABRICATED USING THEREOF
METHOD FOR FABRICATING ULTRA-HIGH RELIABLE MICRO-ELECTRONIC PACKAGE AND MICRO-ELECTRONIC PACKAGE FABRICATED USING THEREOF
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机译：制造超高可靠性的微电子封装的方法和使用该封装制造的微电子封装
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摘要
The invention microelectronic package manufacturing method and a microelectronic package having a high reliability is manufactured by using this relates, in microelectronic package (Micro-electronic Package) manufacturing method according to the present invention in the core substrate and the resin layer are stacked microelectronic package manufacturing method, the resin layer to the core substrate (Core Substrate) with the same material but forming the core substrate is an epoxy substrate (Epoxy Core), accordingly the epoxy resin (Epoxy) as forming material, and optionally a mechanical removal process to pattern the resin layer and the composite method using Huaxia enemy ablative but processed in such a way, the mechanical removal method is characterized in that it comprises a turbulent jet treatment (Jet-Turbulent Treatment), and the chemical reduction method is related to the invention comprising the permanganate process (Permanganate Treatment) . ;
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