SEMICONDUCTOR CHIP WITH A TSV(THROUGH SILICON VIA) AND MULTI CHIP PACKAGE INCLUDING THE SAME

• 1. 制造硅通孔的方法和包括硅通孔的芯片 [P] . 中国专利： CN106328584B . 2018.09.21
• 2. 制造硅通孔的方法和包括硅通孔的芯片 [P] . 中国专利： CN106328584A . 2017-01-11
• 3. SEMICONDUCTOR CHIP, PRINTED CIRCUIT BOARD, MULTI-CHIP PACKAGE INCLUDING THE SEMICONDUCTOR CHIP AND PRINTED CIRCUIT BOARD, AND METHOD OF MANUFACTURING THE MULTI-CHIP PACKAGE [P] . 美国专利： US2019295975A1 . 2019-09-26

  机译： 半导体芯片，印刷电路板，包括半导体芯片和印刷电路板的多芯片封装，以及制造多芯片封装的方法

• 4. Semiconductor chip having TSV (through silicon via) and stacked assembly including the chips [P] . 美国专利： US7838967B2 . 2010-11-23

  机译： 具有TSV（硅直通）和包括该芯片的堆叠组件的半导体芯片

• 5. SEMICONDUCTOR CHIP HAVING TSV (THROUGH SILICON VIA) AND STACKED ASSEMBLY INCLUDING THE CHIPS [P] . 美国专利： US2009267194A1 . 2009-10-29

  机译： 具有硅通孔（TSV）的半导体芯片（通过硅晶片）和包括芯片在内的堆叠组件

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• 6. Structural Optimization & Reliability of 3D Package by Studying Crack Behavior on TSV & BEOL & Impact of Power Cycling on Reliability Flip Chip Package [D] . Rahangdale, Unique. 2017
• 7. MultiChIPmixHMM: an R package for ChIP-chip data analysis modeling spatial dependencies and multiple replicates [O] . Caroline Bérard, Michael Seifert, Tristan Mary-Huard, 2013
• 8. Scheduling Methodology for MCP(Multi-chip Package) with Layer Sequence Constraint in Semiconductor Package [O] . Young-Hyun Jeong, Kang-Hoon Cho, You-In Choung, 2017
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